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Key factors in the selection of lead-free solders |
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 Nihon Superior Co., Ltd. announces that it will be issue a new series of guides on "Key Factors in the Selection of Lead-Free Solders." This series is intended to address the challenges in choosing a reliable lead-free solder. The first guide in the series is titled "Reliability of Lead-Free Solder in Thermal Cycling."
Solder is used to connect electrical components to printed circuit boards to make functioning electronic devices. Recently, there has been a significant increase in interest in eco-friendly hybrid and/or electric vehicles that can be exposed to extreme temperatures during service. Therefore, resistance of a solder joint to thermal fatigue is an important characteristic.
From the cross-sections below it is clear that in thermal cycling there are significant differences between the SN100C (Sn-0.7Cu-0.05Ni+Ge) and the Sn-3.8Ag-0.7Cu alloy. Cracks started to appear in the latter alloy after 2000 cycles with compete failure at by 4000 cycles. In the joints made with SN100C, there was no significant cracking until 4000 cycles. The conclusion is that SN100C has excellent resistance to thermal fatigue.
www.nihonsuperior.com
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